Microetching composition and method of using the same

Details Microetching composition and method of using the same Microetching composition and method of using the same

2005-12-21

2008-11-25

Deo, Duy-Vu N (Department: 1792)

Semiconductor device manufacturing: process

Chemical etching

Liquid phase etching

C438S754000, C252S079100, C252S079200, C252S079300, C252S079400, C216S093000, C216S105000, C216S106000

Reexamination Certificate

active

07456114

ABSTRACT:
The present invention is directed to a microetching composition comprising a source of cupric ions, acid, a nitrile compound, and a source of halide ions. Other additive, including organic solvents, a source of molybdenum ions, amines, polyamines, and acrylamides may also be included in the composition of the invention. The present invention is also directed to a method of microetching copper or copper alloy surfaces to increase the adhesion of the copper surface to a polymeric material, comprising the steps of contacting a copper or copper alloy surface with the composition of the invention, and thereafter bonding the polymeric material to the copper or copper alloy surface.

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