Microencapsulation method, microelectronic devices made therefro

Details Microencapsulation method, microelectronic devices made therefro Microencapsulation method, microelectronic devices made therefro

1991-01-14

1992-03-10

Michl, Paul R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

428416, 525396, 525485, 525523, C08G 5944

Patent

active

050950533

ABSTRACT:
A method for encapsulating microelectronic devices is provided using a heat curable epoxy composition having a monomeric or polymeric diaryliodonium hexafluoroantimonate salt. Curable compositions are also provided as well as encapsulated microelectronic devices.

REFERENCES:
patent: 3658750 (1972-04-01), Tsukui et al.
patent: 3838094 (1974-09-01), Sporck
patent: 4173551 (1979-11-01), Crivello
patent: 4238587 (1980-12-01), Cirvello
patent: 4308118 (1981-12-01), Dudgeon
patent: 4845159 (1989-07-01), Chao
Lee et al.; Handbook of Epoxy Resins; McGraw-Hill Book Co.; 1967; pp. 2-17, 4-12, 4-30.
Katz et al.; Handbook of Fillers and Reinforcements for Plastics; 1978; Van Nostrand Reinhold Co.; pp. 155-158.

Affiliated with

Also associated with

Rating

Microencapsulation method, microelectronic devices made therefro does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microencapsulation method, microelectronic devices made therefro, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microencapsulation method, microelectronic devices made therefro will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2285032