Microencapsulated epoxy adhesive system

Details Microencapsulated epoxy adhesive system Microencapsulated epoxy adhesive system

1982-06-15

1985-08-20

Lovering, Richard D.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

156330, 411258, 42840221, 523211, 523406, C09J 314, C09J 316

Patent

active

045365245

ABSTRACT:
A microencapsulated epoxy adhesive system is disclosed comprising in admixture epoxy resin capsules and encapsulated Ancamine TL (Pacific Anchor Chemical Co.) as the curing agent. When applied, for example to a zinc plated bolt and the bolt is tightened, the capsules break and the resin cures and provides good breakaway torques.

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