Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...
Patent
1998-01-20
1998-10-20
Jagannathan, Vasu
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
At least one aryl ring which is part of a fused or bridged...
523210, 428402, 42840221, 4283215, C08K 910
Patent
active
058247246
ABSTRACT:
A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.
REFERENCES:
patent: 2988461 (1961-06-01), Eichel
patent: 3378420 (1968-04-01), Dickinson et al.
patent: 3489599 (1970-01-01), Kriehle
patent: 3686701 (1972-08-01), Charle et al.
patent: 3811980 (1974-05-01), Roderhoff
patent: 3814156 (1974-06-01), Bachmann et al.
patent: 3821060 (1974-06-01), Braca et al.
patent: 3922373 (1975-11-01), Bayless
patent: 4073946 (1978-02-01), Bayless
patent: 4107071 (1978-08-01), Bayless
patent: 4200480 (1980-04-01), Wolinski et al.
patent: 4207697 (1980-06-01), Murphy
patent: 4377621 (1983-03-01), Hart et al.
patent: 4536524 (1985-08-01), Hart et al.
patent: 4672084 (1987-06-01), Dierdorf et al.
patent: 4865938 (1989-09-01), Sakai et al.
patent: 5297819 (1994-03-01), Harder
patent: 5384345 (1995-01-01), Naton
patent: 5416142 (1995-05-01), Bush et al.
patent: 5470894 (1995-11-01), Patel et al.
Hillenbrand Gary F.
Lynch Roland M.
Maccarone David A.
Newsom Morris F.
Roesch Mark A.
Asinovsky Olga
Jagannathan Vasu
The Lamson & Sessions Co.
LandOfFree
Microencapsulatable solvent adhesive composition and method for does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Microencapsulatable solvent adhesive composition and method for , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microencapsulatable solvent adhesive composition and method for will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-245015