Microelectronics unit mounting with multiple lead bonding

Details Microelectronics unit mounting with multiple lead bonding Microelectronics unit mounting with multiple lead bonding

1995-05-08

1998-08-18

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29830, 22818022, 439 66, 439 91, H05K 334

Patent

active

057943303

ABSTRACT:
A component for mounting semiconductor chips or other microelectronic units includes a flexible top sheet with an array of terminals on it, and with flexible leads extending downwardly from the terminals. A compliant dielectric support layer surrounds the leads, holding the lead tips in precise locations. The leads are desirably formed from wire such as gold wire, and have eutectic bonding alloy on their tips. The component can be laminated to a chip or other unit under heat and pressure to form a complete subassembly with no need for individual bonding to the contacts of the chip. The subassembly can be tested readily and provides compensation for thermal expansion.

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