Microelectronics package

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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428426, 428432, 428457, 428901, B32B 900

Patent

active

053245709

ABSTRACT:
A microelectronics substrate assembly comprising: an advanced ceramics substrate having a top surface and a bottom surface; a first metallized distribution plane on said top surface and a second metallized distribution plane on said bottom surface; an electrical connection between said first and second distribution planes; at least one first metallized pad on said top surface electrically isolated from said first distribution plane and at least one metallized pad on said bottom surface, electrically isolated from said second distribution plane, wherein said distribution planes and said metallized pads are arranged substantially symmetrically with respect to a plane between and parallel to said top and said bottom surfaces.

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Spitz "Ceramics Keep Circuits Cool" Electronic Packaging and Production vol. 29, No. 7, Jul. 1989 Massachusetts US pp. 36-41.

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