Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1992-12-17
1994-06-28
Ryan, Patrick J.
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
428426, 428432, 428457, 428901, B32B 900
Patent
active
053245709
ABSTRACT:
A microelectronics substrate assembly comprising: an advanced ceramics substrate having a top surface and a bottom surface; a first metallized distribution plane on said top surface and a second metallized distribution plane on said bottom surface; an electrical connection between said first and second distribution planes; at least one first metallized pad on said top surface electrically isolated from said first distribution plane and at least one metallized pad on said bottom surface, electrically isolated from said second distribution plane, wherein said distribution planes and said metallized pads are arranged substantially symmetrically with respect to a plane between and parallel to said top and said bottom surfaces.
REFERENCES:
patent: 3561110 (1971-02-01), Feulner et al.
patent: 3838204 (1974-09-01), Ahn et al.
patent: 3852877 (1974-12-01), Ahn et al.
patent: 4131516 (1978-12-01), Bakos et al.
patent: 4376287 (1983-03-01), Sechi
patent: 4446477 (1984-05-01), Currie et al.
patent: 4684446 (1987-08-01), Charles et al.
patent: 4714905 (1987-12-01), Bernstein et al.
patent: 4732780 (1988-03-01), Mitoff et al.
patent: 4835059 (1989-05-01), Kodato
patent: 4861641 (1984-08-01), Foster et al.
patent: 4894271 (1990-01-01), Hani et al.
patent: 4899118 (1990-02-01), Polinski, Jr.
patent: 4917958 (1990-04-01), Akai et al.
patent: 4925723 (1990-05-01), Bujatti et al.
patent: 4942076 (1990-07-01), Panicker et al.
Panicker et al "Thermal Substrates: A New Microwave Substrate Technology for Thermal Management and Low Parasitic Effects" Microwave Journal, pp. 99-105.
Spitz "Ceramics Keep Circuits Cool" Electronic Packaging and Production vol. 29, No. 7, Jul. 1989 Massachusetts US pp. 36-41.
Ommen Joseph M.
Rogers Paul M.
Lee Kam F.
Ryan Patrick J.
The Carborundum Company
LandOfFree
Microelectronics package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Microelectronics package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microelectronics package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2376498