Microelectronics package

Details Microelectronics package Microelectronics package

1992-12-17

1994-06-28

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428426, 428432, 428457, 428901, B32B 900

Patent

active

053245709

ABSTRACT:
A microelectronics substrate assembly comprising: an advanced ceramics substrate having a top surface and a bottom surface; a first metallized distribution plane on said top surface and a second metallized distribution plane on said bottom surface; an electrical connection between said first and second distribution planes; at least one first metallized pad on said top surface electrically isolated from said first distribution plane and at least one metallized pad on said bottom surface, electrically isolated from said second distribution plane, wherein said distribution planes and said metallized pads are arranged substantially symmetrically with respect to a plane between and parallel to said top and said bottom surfaces.

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Panicker et al "Thermal Substrates: A New Microwave Substrate Technology for Thermal Management and Low Parasitic Effects" Microwave Journal, pp. 99-105.
Spitz "Ceramics Keep Circuits Cool" Electronic Packaging and Production vol. 29, No. 7, Jul. 1989 Massachusetts US pp. 36-41.

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