Microelectronics module

Details Microelectronics module Microelectronics module

1984-09-13

1987-03-24

Tolin, G. P.

Electricity: electrical systems and devices

Miscellaneous

361395, 361410, 361412, 339 17M, H05K 111, H05K 114

Patent

active

046529772

ABSTRACT:
A microelectronics module and method for fabricating a microelectronics module has an electronic surface mounted device soldered to a thick film multilayer circuit disposed on an interconnect ceramic substrate, and the interconnect ceramic substrate is soldered to a co-fired multilayer ceramic substrate having a plurality of pin conductors brazed to the underside of the co-fired multilayer ceramic substrate.

REFERENCES:
patent: 3324353 (1967-06-01), Retzlaff
patent: 3428954 (1964-02-01), David
patent: 4322778 (1982-03-01), Barbour
patent: 4349862 (1982-09-01), Bajorek
IBM Tech Discl Bull, vol. 22, No. 5, Oct. 1979, pp. 1841-1842, "Multilayer Ceramic . . . Design", Johnson.
"A Comparison of Thin Film, Thick Film, and Co-Fired High Density Ceramic Multilayer with the Combined Technology: T&T HDCM (Thin Film and Thick Film High Density Ceramic Module)"; Dr. Terasawa and S. Minami and J. Rubin, Oct. 1983.

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