Microelectronics apparatus

Electricity: conductors and insulators – Conduits – cables or conductors – Single duct conduits

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Details

29847, 361409, 361414, H05K 100

Patent

active

047646446

ABSTRACT:
A microelectronics apparatus and a method of fabricating customized connections between wiring planes superposed on a substrate is disclosed. A first wiring plane having multiple conductors is formed upon the substrate. An insulating layer is formed that overlies and electrically insulates the first wiring plane. A second wiring plane having multiple conductors is formed above the insulating layer by forming multiple conductors that are electrically connected to the first wiring plane with selected conductors of the first wiring plane being electrically connected to selected conductors of the second wiring plane. The connections may be modified by breaking selected ones of the electrical connections between the first and second wiring planes to customize the electrical interconnections.

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Klippel, W. H.; "Method for Producing Three Dimensional Printed Circuits"; IBM Technical Disclosure Bulletin; vol. 2, No. 4; Dec. 1959; pp. 7 and 8.

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