Microelectronic vacuum field emission device

Electric lamp and discharge devices – Discharge devices having a multipointed or serrated edge...

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313351, H01J 130

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active

052143465

ABSTRACT:
According to an embodiment of the present invention, a planar microelectronic vacuum triode comprises a cathode with three tips for electron emission that have been sharpened to points better than 1000 .ANG. by a microfabrication process of over-etching (excess etching) the cathode electrode layer. The cathode tips and, alternatively, an anode electrode too are elevated above the surface of a substrate such that a straight-line path exists for electrons to flow from the cathode tips to the anode. A self-aligned fabrication process is used to advantage to have the edge of a gate electrode that is nearest to the cathode and its tips complement the adjacent edge of the cathode electrode. The combination results in very low threshold voltages needed to initiate the electron flow and a high yield of anode current compared to cathode current. The addition of a shield electrode to the triode produces a tetrode device that exhibits a very high anode resistance.

REFERENCES:
patent: 4168213 (1979-09-01), Hoeberechts
patent: 4578614 (1986-03-01), Gray et al.
patent: 4827177 (1989-05-01), Lee et al.
patent: 4855636 (1989-08-01), Busta et al.
patent: 4904895 (1990-02-01), Tsukamato et al.
Journal of Applied Physics, "Physical properties of thin-film field emission cathodes with molybdenum cones", C. A. Spindt, et al. vol. 47, No. 12, Dec. 1976 pp. 5248-5263.
Electronic Engineering Collective Research Institute Report, "Fabrication of Micron-size Vacuum Triodes with Si Field Emitters", J. Itoh vol. 53, No. 10, Jun. 5, 1989 pp. 1171-1182.

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