Microelectronic substrate including embedded components and...

Details Microelectronic substrate including embedded components and... Microelectronic substrate including embedded components and...

2006-12-11

2010-10-05

Levi, Dameon E (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S760000, C361S734000, C361S739000, C361S748000, C361S750000, C361S757000, C361S762000, C361S763000, C174S255000, C174S256000

Reexamination Certificate

active

07808797

ABSTRACT:
A microelectronic substrate, a method of forming the same, and a system including the same. The microelectronic substrate comprises: a conductive layer; a spacer layer disposed onto the conductive dielectric layer; a dielectric build-up layer disposed onto the spacer layer, the spacer layer being made of a material that has a lower shrinkage than a material of the embedding dielectric-build-up layer during curing, and a higher viscosity than a material of the embedding dielectric build-up layer in its pre-cure form and during curing; and active or passive microelectronic components embedded within the dielectric build-up layer.

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