Microelectronic substrate active thermal cooling wick

Details Microelectronic substrate active thermal cooling wick Microelectronic substrate active thermal cooling wick

1998-12-09

2000-06-06

Lazarus, Ira S.

Heat exchange

With first fluid holder or collector open to second fluid

Separate external discharge port for each fluid

165 86, F28D 1704

Patent

active

060706562

ABSTRACT:
A dynamic microelectronic cooling wick is displaced from and juxtaposed to a heated substrate for creating a capillary wick providing dynamic capillary pumping action of a cooling fluid for temperature regulation of the substrate. The wick consists of at least two materials having different coefficients of thermal expansion so that the wick flexes in the presence of changing temperature to thereby change the effective radius of the capillary wick to transport the fluid to a substrate hot spot.

REFERENCES:
patent: 3307783 (1967-03-01), Wiebelt
patent: 5659285 (1997-08-01), Takeda
patent: 5769154 (1998-06-01), Adkins
Carbone et al., Metallic wick for a heat pipe, IBM Technical Disclosure Bulletin, vol. 13 No. 9, pp.1-2.

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