Microelectronic sensor assembly

Details Microelectronic sensor assembly Microelectronic sensor assembly

1982-04-08

1985-04-30

Tung, T.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204400, 204403, 330307, 357 72, 357 80, G01N 2746

Patent

active

045142769

ABSTRACT:
A microelectronic semiconductor element 12 is mounted on to a header 13, and integrally combined with one or more metallic sensing electrodes 20, 21 by encapsulation in a chemically and electrically inert material 19, to provide a miniature sensor assembly suitable for the detection and measurement of oxygen and other substances.
Gold or gold alloy semiconductor-device bonding wires are suitable as the metallic sensing electrodes and permit low-cost, mass-production capability. The basic assembly can be engineered in various forms for different biomedical applications and is readily modified, by the addition of appropriate electro-active films to the device surface, into a sensor for a variety of chemical and biochemical substances, including enzyme substrates.

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