Microelectronic packages having rail along portion of lid...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

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Details

C257S712000, C257S713000, C257S796000

Reexamination Certificate

active

06958536

ABSTRACT:
The invention encompasses microelectronic package lids, heat spreaders, and semiconductor packages comprising microelectronic lids or heat spreaders. In particular aspects of the present invention, a microelectronic lid comprises a material having a rectangular peripheral shape that defines 4 peripheral sides. Further, the lid has projecting peripheral rails along less than all of the peripheral edge. For instance, the lid can have projecting peripheral rails along only 2 of the sides. Alternatively, such microelectronic lid can be described as comprising a generally rectangular shape defining four peripheral edges, with two of the edges having a greater thickness than the other two edges.

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patent: 0 174 020 (1986-03-01), None
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patent: 359863 (1986-11-01), None

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