Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2005-10-25
2005-10-25
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S712000, C257S713000, C257S796000
Reexamination Certificate
active
06958536
ABSTRACT:
The invention encompasses microelectronic package lids, heat spreaders, and semiconductor packages comprising microelectronic lids or heat spreaders. In particular aspects of the present invention, a microelectronic lid comprises a material having a rectangular peripheral shape that defines 4 peripheral sides. Further, the lid has projecting peripheral rails along less than all of the peripheral edge. For instance, the lid can have projecting peripheral rails along only 2 of the sides. Alternatively, such microelectronic lid can be described as comprising a generally rectangular shape defining four peripheral edges, with two of the edges having a greater thickness than the other two edges.
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Flynn Nathan J.
Mandala Jr. Victor A.
Wells St. John P.S.
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