Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-12-23
2011-11-15
Nguyen, Khiem D (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S110000, C438S112000, C257S678000, C257S686000, C257SE21499
Reexamination Certificate
active
08058101
ABSTRACT:
A method of making a microelectronic assembly includes providing a microelectronic package having a substrate, a microelectronic element overlying the substrate and at least two conductive elements projecting from a surface of the substrate, the at least two conductive elements having surfaces remote from the surface of the substrate. The method includes compressing the at least two conductive elements so that the remote surfaces thereof lie in a common plane, and after the compressing step, providing an encapsulant material around the at least two conductive elements for supporting the microelectronic package and so that the remote surfaces of the at least two conductive elements remain accessible at an exterior surface of the encapsulant material.
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Chau Ellis
Haba Belgacem
Kang Teck-Gyu
Mohammed Ilyas
Lerner David Littenberg Krumholz & Mentlik LLP
Nguyen Khiem D
Tessera Inc.
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