Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate
2005-05-31
2005-05-31
Ghyka, Alexander (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
C257S678000
Reexamination Certificate
active
06900080
ABSTRACT:
A microelectronic package and method for manufacture. The package can include a support member and a microelectronic substrate positioned at least proximate to the support member. The microelectronic substrate can have a first surface and a second surface facing opposite the first surface, with the first surface having an outer edge and facing toward the support member. At least a portion of the first surface can be spaced apart from an interior surface of the support member to define an intermediate region. At least one conductive coupler is coupled between the microelectronic substrate and the support member. A generally electrically non-conductive material is positioned in the intermediate region with the material contacting the support member and the first surface of the microelectronic substrate and having an outer surface recessed inwardly from the outer edge of the microelectronic substrate.
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Jiang Tongbi
Storli Farrah J.
Ghyka Alexander
Perkins Coie LLP
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