Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1995-10-13
1997-12-09
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257715, 257796, 361687, 361688, H01L 2334, H01L 2328, H05K 500, H05K 720
Patent
active
056964056
ABSTRACT:
A microelectronics package has improved device cooling. The package includes a lead frame defining an upper and lower surface. An active electronic device, such as an integrated circuit, is positioned above the upper surface of the lead frame. An encapsulating package is molded around both the lead frame and the active electronic device to form the microelectronic package. A cooling tube is integrally molded within the encapsulating package and typically formed of a thermally conductive material such as copper. A cooling fluid, such as air or a liquid, can be moved through the cooling tube for discharging the heat generated by the active electronic device.
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Clark Jhihan B.
Lucent Technologies - Inc.
Saadat Mahshid D.
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