Microelectronic package including temperature sensor...

Details Microelectronic package including temperature sensor... Microelectronic package including temperature sensor...

2006-06-23

2009-12-29

Malsawma, Lex (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S467000, C257SE23080, C438S054000, C438S055000, C361S717000

Reexamination Certificate

active

07638874

ABSTRACT:
A microelectronic package, a method of forming the package and a system incorporating the package. The package includes a substrate; a die bonded to the substrate; and a thermal sensor connected to the substrate.

REFERENCES:
patent: 5831333 (1998-11-01), Malladi et al.
patent: 6092926 (2000-07-01), Still et al.
patent: 6726455 (2004-04-01), Horng et al.
patent: 6781056 (2004-08-01), O'Rourke et al.
patent: 2003/0147225 (2003-08-01), Kenny et al.
http://wps2a.semi.org/wps/portal/—pagr/135/—pa.135/745?&dFormat=application/msword&docNarne=P037178.

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