Microelectronic package having stacked semiconductor devices...

Details Microelectronic package having stacked semiconductor devices... Microelectronic package having stacked semiconductor devices...

2008-01-08

2008-01-08

Prenty, Mark V. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S778000

Reexamination Certificate

active

11021627

ABSTRACT:
A packaged microelectronic device having a first and second electrically interconnected microelectronic elements and a method for its manufacture. Conductive posts extend from one major surface of the first microelectronic element. The first microelectronic element is electrically interconnected to the second microelectronic element via the conductive posts. The first microelectronic element preferably has an interposer element from which the conductive posts extend. The second microelectronic element is interconnected to the interposer element via contacts on the second microelectronic element via the conductive posts. The so interconnected microelectronic elements have coordinated functionality, such as a programmable logic device wherein one microelectronic element is a field programmable gate array and the other microelectronic element is a memory device. The packaged microelectronic device is formed by using a transfer substrate to transfer solder masses onto at least some of the conductive posts extending from the first major surface of the first microelectronic element or contacts on the second microelectronic element. The solder masses are then used to electrically interconnect the conductive posts with the contacts disposed on the surface of the second microelectronic element.

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patent: 6452259 (2002-09-01), Akiyama
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patent: 2004/0238857 (2004-12-01), Beroz et al.
patent: 2006/0138647 (2006-06-01), Crisp et al.
patent: 1 458 024 (2004-09-01), None

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