Microelectronic package containing silicon patches for high...

Details Microelectronic package containing silicon patches for high... Microelectronic package containing silicon patches for high...

2008-03-31

2011-11-22

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C257SE21499, C361S762000, C438S121000

Reexamination Certificate

active

08064224

ABSTRACT:
A microelectronic package comprises a substrate (110), a silicon patch (120) embedded in the substrate, a first interconnect structure (131) at a first location of the silicon patch and a second interconnect structure (132) at a second location of the silicon patch, and an electrically conductive line (150) in the silicon patch connecting the first interconnect structure and the second interconnect structure to each other.

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