Microelectronic package

Details Microelectronic package Microelectronic package

1985-08-27

1987-11-10

Grimley, Arthur T.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 74, 361401, 361414, H01L 2302

Patent

active

047059176

ABSTRACT:
A microelectronic package for the protection, housing, cooling and interconnection of a microelectronic chip. The package is made of a plurality of ceramic layers, each of which carries a particular electrically conductive pattern and which have interior openings therein so as to provide recesses in which the chip and discrete capacitors can be located and connected.

REFERENCES:
patent: 3753054 (1973-08-01), Johnson
patent: 4288841 (1981-09-01), Gogal
patent: 4322778 (1982-03-01), Barbour et al.
patent: 4513355 (1985-04-01), Schroeder et al.
patent: 4551746 (1985-11-01), Gilbert et al.

Affiliated with

Also associated with

Rating

Microelectronic package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microelectronic package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microelectronic package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1069269