Microelectronic mounting with multiple lead deformation using re

Details Microelectronic mounting with multiple lead deformation using re Microelectronic mounting with multiple lead deformation using re

1997-12-12

1999-11-02

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438117, 438121, 438123, 438125, 438126, H01L 2144, H01L 2148, H01L 2150

Patent

active

059769130

ABSTRACT:
A microelectronic assembly is made by providing flexible leads extending between two components, and moving the components in a vertical direction away from one another so as to deform the leads to a more vertical configuration. Restraining straps extending between the components constrain the movement and assure that the leads are not pulled away from the components during the process. The restraining straps may also cause the components to move with a component of motion in a horizontal direction during the vertical movement, thereby deforming the leads to a curved configuration.

REFERENCES:
patent: 5518964 (1996-05-01), DiStefano et al.
patent: 5688716 (1997-11-01), DiStefano et al.

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