Microelectronic mounting with multiple lead deformation and bond

Details Microelectronic mounting with multiple lead deformation and bond Microelectronic mounting with multiple lead deformation and bond

1994-07-07

1996-05-21

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437211, 437214, 437217, 437219, 437220, H01L 2120

Patent

active

055189644

ABSTRACT:
A microelectronic connection component includes a dielectric sheet having an area array of elongated, strip-like leads. Each lead has a terminal end fastened to the sheet and a tip end detachable from the sheet. Each lead extends horizontally parallel to the sheet, from its terminal end to its tip end. The tip ends are attached to a second element, such as another dielectric sheet or a semiconductor wafer. The first and second elements are then moved relative to one another to advance the tip end of each lead vertically away from the dielectric sheet and deform the leads into a bent, vertically extensive configuration. The preferred structures provide semiconductor chip assemblies with a planar area array of contacts on the chip, an array of terminals on the sheet positioned so that each terminal is substantially over the corresponding contact, and an array of metal S-shaped ribbons connected between the terminals and contacts. A compliant dielectric material may be provided between the sheet and chip, substantially surrounding the S-shaped ribbons.

REFERENCES:
patent: 3373481 (1968-03-01), Lins et al.
patent: 3795037 (1974-03-01), Luttmer
patent: 3811186 (1974-05-01), Larnerd et al.
patent: 3952404 (1976-04-01), Matunami
patent: 4067104 (1978-01-01), Tracy
patent: 4142288 (1979-03-01), Flammer et al.
patent: 4326663 (1982-04-01), Oettel
patent: 4447857 (1984-05-01), Marks et al.
patent: 4520562 (1985-06-01), Sade et al.
patent: 4629957 (1986-12-01), Walteis et al.
patent: 4661192 (1987-04-01), McShaen
patent: 4667219 (1987-05-01), Lee et al.
patent: 4721995 (1988-01-01), Tanizawa
patent: 4751199 (1988-06-01), Phy
patent: 4785137 (1988-11-01), Samuels
patent: 4793814 (1988-12-01), Zifcak et al.
patent: 4812191 (1989-03-01), Ho et al.
patent: 4893172 (1990-01-01), Matsummoto et al.
patent: 4926241 (1990-05-01), Carey
patent: 4949158 (1990-08-01), Ueda
patent: 4954877 (1990-09-01), Nakanishi et al.
patent: 4955523 (1990-09-01), Calomagno et al.
patent: 5047830 (1991-09-01), Grabbe
patent: 5049085 (1991-09-01), Reylek et al.
patent: 5055907 (1991-10-01), Jacobs
patent: 5057460 (1991-10-01), Rose
patent: 5067007 (1991-11-01), Kanji et al.
patent: 5086337 (1992-02-01), Noro et al.
patent: 5129716 (1993-03-01), Jacobs
patent: 5131852 (1992-07-01), Grabbe et al.
patent: 5152695 (1992-10-01), Grabbe et al.
patent: 5166099 (1992-11-01), Ueda et al.
patent: 5173055 (1992-12-01), Grabbe
patent: 5197892 (1993-03-01), Yoshizawa et al.
patent: 5210939 (1993-05-01), Mallik et al.
patent: 5230931 (1993-07-01), Yanizak et al.
patent: 5254811 (1993-11-01), Ludden et al.
patent: 5286680 (1994-02-01), Cain
patent: 5346861 (1994-09-01), Khandros et al.
"Method of Testing Chips and Joining Chips to Substrates", Research Disclosure, Feb. 1991, No. 322, Kenneth Mason Publication Ltd., England.
IBM Technical Disclosure Bulletin, vol. 36, No. 07, Jul. 1993.

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