Microelectronic module having optical and electrical interconnec

Details Microelectronic module having optical and electrical interconnec Microelectronic module having optical and electrical interconnec

1997-04-17

1999-07-13

Ngo, Hung N.

Optical waveguides

Integrated optical circuit

385 37, 359 15, 359 34, 257 82, 257 98, G03H 100

Patent

active

059237961

ABSTRACT:
A multichip module having high density optical and electrical interconnections between integrated circuit chips includes a substrate overlaying an array of integrated circuit chips. An optical transmitter generates a first optical beam through the substrate and an optical detector receives a second optical beam through the substrate. A hologram is positioned in the path of at least one of the first and second optical beams. An array of electrical contact pads is located on the substrate corresponding to the array of electrical contact pads on the respective integrated circuit chips. A pattern of electrical interconnection lines is located on the substrate for electrically interconnecting the integrated circuit chips. A solder bump between electrical contact pads on the substrate and on the integrated circuit chips establish electrical connections between the substrate and the integrated circuit chips, and also facilitate alignment of the integrated circuit chips with respect to the substrate. The optical transmitter and detector may be mounted on/in the substrate or on/in the integrated circuit chips. The optical transmitter and detector may also be used to provide optical connections external to the microelectronic module, using a holographic substrate to optically link modules. The substrate may also be used to establish optical alignment of the hologram to an underlying optical emitter and/or optical detector without establishing electrical connections thereto.

REFERENCES:
patent: 4422088 (1983-12-01), Gfeller
patent: 4533833 (1985-08-01), Copeland et al.
patent: 4703993 (1987-11-01), Hinton et al.
patent: 4711997 (1987-12-01), Miller
patent: 4720634 (1988-01-01), D'Auria et al.
patent: 4732446 (1988-03-01), Gipson et al.
patent: 4762382 (1988-08-01), Husain et al.
patent: 4774630 (1988-09-01), Reisman et al.
patent: 4818045 (1989-04-01), Chang
patent: 4838630 (1989-06-01), Jannson et al.
patent: 4871224 (1989-10-01), Karstensen et al.
patent: 4912545 (1990-03-01), Go
patent: 4917450 (1990-04-01), Pochoile et al.
patent: 4933561 (1990-06-01), Goransson et al.
patent: 4946253 (1990-08-01), Kostuck
patent: 4966430 (1990-10-01), Weidel
patent: 5061027 (1991-10-01), Richard
patent: 5100220 (1992-03-01), Voegeli
patent: 5101460 (1992-03-01), Richard
patent: 5130531 (1992-07-01), Ito et al.
patent: 5159700 (1992-10-01), Reid et al.
patent: 5163113 (1992-11-01), Melman
patent: 5198684 (1993-03-01), Sudo
patent: 5200631 (1993-04-01), Austin et al.
patent: 5237434 (1993-08-01), Feldman et al.
patent: 5247597 (1993-09-01), Blacha et al.
patent: 5335361 (1994-08-01), Ghaem
patent: 5394490 (1995-02-01), Kato et al.
patent: 5446814 (1995-08-01), Kuo et al.
patent: 5513021 (1996-04-01), Kaneshiro et al.
patent: 5638469 (1997-06-01), Feldman et al.
F. Kiamilev, et al., Optically Interconnected MCMs for Gigabit ATM Switches, SPIE, vol. 1849, Optoelectronic Interconnects (1993), pp. 160-171.
J.E. Morris, et al., Prototype Optically Interconnected Multichip Module Based on Computer Generated Hologram Technology, SPIE, vol. 1849, Optoelectronic Interconnects (1993), pp. 48-53.
P.R. Haugen, et al., Optical Interconnects for High Speed Computing, Optical Engineering 25 (10), Oct. 1986, pp. 1076-1085.
M.R. Feldman, et al., Interconnect Density Capabilities of Computer Generated Holograms for Optical Interconnection of Very Large Scale Integrated Circuits, Applied Optics, vol. 28, No. 15, Aug. 1989, pp. 3134-3137.
M.R. Feldman, et al., Comparison Between Optical and Electrical Interconnects Based on Power and Speed Considerations, Applied Optics, vol. 27, No. 9, May 1988, pp. 1742-1751.
PCT International Search Report dated Mar. 9, 1993 of International Appln. No. PCT/US92/09381 filed Feb. 11, 1992.
H.W. Markstein, Optics Evolve as a Viable Interconnection Alternative, 8307 Electronic Packaging & Production 31 (1991), Apr., No. 4.
E. Bradley, et al., System Issues Relating to Laser Diode Requirements for VLSI Holographic Optical Interconnects, Optical Engineering, vol. 28 (1989) Mar., No. 3, pp. 201-211.
S.K. Tewksbury, et al., Chip Alignment Templates for Multichip Module Assembly, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. CHMT-10, No. 1, Mar. 1987, pp. 111-121.

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