Microelectronic imaging units and methods of manufacturing...

Details Microelectronic imaging units and methods of manufacturing... Microelectronic imaging units and methods of manufacturing...

2008-04-09

2010-02-02

Smith, Bradley K (Department: 2894)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Having light transmissive window

C438S064000

Reexamination Certificate

active

07655507

ABSTRACT:
Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method includes coupling a plurality of singulated imaging dies to a support member. The individual imaging dies include an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes forming a plurality of stand-offs on corresponding imaging dies before and/or after the imaging dies are singulated and electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member. The individual stand-offs include a portion between adjacent external contacts.

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