Microelectronic imaging units and methods of manufacturing...

Details Microelectronic imaging units and methods of manufacturing... Microelectronic imaging units and methods of manufacturing...

2008-07-02

2010-12-28

Thai, Luan C (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

C438S064000, C438S065000, C257SE21599

Reexamination Certificate

active

07858420

ABSTRACT:
Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method includes coupling a plurality of singulated imaging dies to a support member. The individual imaging dies include an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes forming a plurality of stand-offs on corresponding imaging dies before and/or after the imaging dies are singulated and electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member. The individual stand-offs include a portion between adjacent external contacts.

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