Microelectronic imagers with optical devices having integral...

Details Microelectronic imagers with optical devices having integral... Microelectronic imagers with optical devices having integral...

2011-08-09

2011-08-09

Nguyen, Cuong Q (Department: 2811)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S027000, C438S029000

Reexamination Certificate

active

07993944

ABSTRACT:
Microelectronic imager assemblies with optical devices having integral reference features and methods for assembling such microelectronic imagers is disclosed herein. In one embodiment, the imager assembly can include a workpiece with a substrate having a front side, a back side, and a plurality of imaging dies on and/or in the substrate. The imaging dies include image sensors, integrated circuitry operatively coupled to the image sensors, and external contacts electrically coupled to the integrated circuitry. The assembly also includes optics supports on the workpiece. The optics supports have openings aligned with corresponding image sensors and first interface features at reference locations relative to corresponding image sensors. The assembly further includes optical devices having optics elements and second interface features seated with corresponding first interface features to position the optics elements at a desired location relative to corresponding image sensors.

REFERENCES:
patent: 3345134 (1967-10-01), Heymer et al.
patent: 4534100 (1985-08-01), Lane
patent: 4906314 (1990-03-01), Farnworth et al.
patent: 5130783 (1992-07-01), McLellan
patent: 5371397 (1994-12-01), Maegawa et al.
patent: 5424573 (1995-06-01), Kato et al.
patent: 5435887 (1995-07-01), Rothschild et al.
patent: 5505804 (1996-04-01), Mizuguchi et al.
patent: 5593913 (1997-01-01), Aoki
patent: 5605783 (1997-02-01), Revelli et al.
patent: 5672519 (1997-09-01), Song et al.
patent: 5694246 (1997-12-01), Aoyama et al.
patent: 5708293 (1998-01-01), Ochi et al.
patent: 5771158 (1998-06-01), Yamagishi et al.
patent: 5773359 (1998-06-01), Mitchell et al.
patent: 5776824 (1998-07-01), Farnworth et al.
patent: 5811799 (1998-09-01), Wu
patent: 5821532 (1998-10-01), Beaman et al.
patent: 5857963 (1999-01-01), Pelchy et al.
patent: 5861654 (1999-01-01), Johnson
patent: 5877040 (1999-03-01), Park et al.
patent: 5897338 (1999-04-01), Kaldenberg
patent: 5914488 (1999-06-01), Sone
patent: 5977535 (1999-11-01), Rostoker
patent: 5998862 (1999-12-01), Yamanaka
patent: 6080291 (2000-06-01), Woodruff et al.
patent: 6104086 (2000-08-01), Ichikawa et al.
patent: 6107180 (2000-08-01), Munroe et al.
patent: 6114240 (2000-09-01), Akram et al.
patent: 6130141 (2000-10-01), Degani et al.
patent: 6143588 (2000-11-01), Glenn
patent: 6236046 (2001-05-01), Watabe et al.
patent: 6259083 (2001-07-01), Kimura
patent: 6266197 (2001-07-01), Glenn et al.
patent: 6268114 (2001-07-01), Wen et al.
patent: 6274927 (2001-08-01), Glenn
patent: 6285064 (2001-09-01), Foster
patent: 6351027 (2002-02-01), Giboney et al.
patent: 6372548 (2002-04-01), Bessho et al.
patent: 6407381 (2002-06-01), Glenn et al.
patent: 6411439 (2002-06-01), Nishikawa
patent: 6441487 (2002-08-01), Elenius et al.
patent: 6452270 (2002-09-01), Huang
patent: 6476985 (2002-11-01), Dou et al.
patent: 6483652 (2002-11-01), Nakamura
patent: 6503780 (2003-01-01), Glenn et al.
patent: 6534863 (2003-03-01), Walker et al.
patent: 6541762 (2003-04-01), Knag et al.
patent: 6560047 (2003-05-01), Choi et al.
patent: 6566745 (2003-05-01), Beyne et al.
patent: 6603183 (2003-08-01), Hoffman
patent: 6617623 (2003-09-01), Rhodes
patent: 6661047 (2003-12-01), Rhodes
patent: 6667551 (2003-12-01), Hanaoka et al.
patent: 6670986 (2003-12-01), Ben Shoshan et al.
patent: 6686588 (2004-02-01), Webster et al.
patent: 6703310 (2004-03-01), Mashino et al.
patent: 6734419 (2004-05-01), Glenn et al.
patent: 6759266 (2004-07-01), Hoffman
patent: 6767036 (2004-07-01), Barker, Jr. et al.
patent: 6770958 (2004-08-01), Wang et al.
patent: 6774486 (2004-08-01), Kinsman
patent: 6778046 (2004-08-01), Stafford et al.
patent: 6791076 (2004-09-01), Webster
patent: 6795120 (2004-09-01), Takagi et al.
patent: 6797616 (2004-09-01), Kinsman
patent: 6800943 (2004-10-01), Adachi
patent: 6813154 (2004-11-01), Diaz et al.
patent: 6825458 (2004-11-01), Moess et al.
patent: 6828663 (2004-12-01), Chen et al.
patent: 6828674 (2004-12-01), Karpman
patent: 6844978 (2005-01-01), Harden et al.
patent: 6864172 (2005-03-01), Noma et al.
patent: 6882021 (2005-04-01), Boon et al.
patent: 6885107 (2005-04-01), Kinsman
patent: 6934065 (2005-08-01), Kinsman
patent: 6946325 (2005-09-01), Yean et al.
patent: 7189954 (2007-03-01), Farnworth et al.
patent: 7429494 (2008-09-01), Oliver et al.
patent: 2001/0055164 (2001-12-01), Dou et al.
patent: 2002/0005997 (2002-01-01), Oba
patent: 2002/0006687 (2002-01-01), Lam
patent: 2002/0057468 (2002-05-01), Segawa et al.
patent: 2002/0089025 (2002-07-01), Chou
patent: 2002/0096729 (2002-07-01), Tu et al.
patent: 2002/0113296 (2002-08-01), Cho et al.
patent: 2002/0145676 (2002-10-01), Kuno et al.
patent: 2003/0048378 (2003-03-01), Kim et al.
patent: 2003/0062601 (2003-04-01), Harnden et al.
patent: 2004/0012698 (2004-01-01), Suda et al.
patent: 2004/0023469 (2004-02-01), Suda
patent: 2004/0038442 (2004-02-01), Kinsman
patent: 2004/0041261 (2004-03-01), Kinsman
patent: 2004/0082094 (2004-04-01), Yamamoto
patent: 2004/0214373 (2004-10-01), Jiang et al.
patent: 2004/0245649 (2004-12-01), Imaoka
patent: 2004/0256687 (2004-12-01), Omori
patent: 2005/0036778 (2005-02-01), DeMonte
patent: 2005/0052751 (2005-03-01), Liu et al.
patent: 2005/0104228 (2005-05-01), Rigg et al.
patent: 2005/0110889 (2005-05-01), Tuttle et al.
patent: 2005/0127478 (2005-06-01), Hiatt et al.
patent: 2005/0151228 (2005-07-01), Tanida et al.
patent: 2005/0236708 (2005-10-01), Farnworth et al.
patent: 2005/0254133 (2005-11-01), Akram et al.
patent: 2005/0258518 (2005-11-01), Yang et al.
patent: 2006/0021221 (2006-02-01), Decker
patent: 2006/0023107 (2006-02-01), Bolken et al.
patent: 2006/0166407 (2006-07-01), Kaushal et al.
patent: 0 886 323 (1998-12-01), None
patent: 1 157 967 (2001-11-01), None
patent: 2 835 654 (2003-08-01), None
patent: 59-101882 (1984-06-01), None
patent: 59-191388 (1984-10-01), None
patent: 07-263607 (1995-10-01), None
patent: 2001-077496 (2001-03-01), None
patent: WO-90/05424 (1990-05-01), None
patent: WO-02/075815 (2002-09-01), None
patent: WO-02/095796 (2002-11-01), None
patent: WO-2004/054001 (2004-06-01), None
U.S. Appl. No. 10/785,466, Kirby.
U.S. Appl. No. 10/845,304, Jiang et al.
U.S. Appl. No. 10/857,948, Boettiger et al.
U.S. Appl. No. 10/863,994, Akram et al.
U.S. Appl. No. 10/864,974, Kirby et al.
U.S. Appl. No. 10/867,352, Farnworth et al.
U.S. Appl. No. 10/867,505, Farnworth et al.
U.S. Appl. No. 10/879,398, Akram et al.
U.S. Appl. No. 10/879,838, Kirby et al.
U.S. Appl. No. 10/893,022, Hall et al.
U.S. Appl. No. 10/894,262, Farnworth et al.
U.S. Appl. No. 10/901,851, Derderian et al.
U.S. Appl. No. 10/910,491, Bolken et al.
U.S. Appl. No. 10/915,180, Street et al.
U.S. Appl. No. 10/919,604, Farnworth et al.
U.S. Appl. No. 10/922,177, Oliver et al.
U.S. Appl. No. 10/922,192, Farnworth.
U.S. Appl. No. 10/925,501, Oliver.
U.S. Appl. No. 10/925,502, Watkins et al.
U.S. Appl. No. 10/927,550, Derderian et al.
U.S. Appl. No. 10/927,760, Chong et al.
U.S. Appl. No. 10/928,598, Kirby.
U.S. Appl. No. 10/932,296, Oliver et al.
U.S. Appl. No. 11/027,443, Kirby.
U.S. Appl. No. 11/054,692, Boemler.
U.S. Appl. No. 11/056,211, Hembree et al.
U.S. Appl. No. 11/056,484, Boettiger et al.
U.S. Appl. No. 11/061,034, Boettiger.
U.S. Appl. No. 11/146,783, Tuttle et al.
U.S. Appl. No. 11/169,546, Sulfridge.
U.S. Appl. No. 11/169,838, Sulfridge.
U.S. Appl. No. 11/177,905, Akram.
U.S. Appl. No. 11/209,524, Akram.
U.S. Appl. No. 11/217,169, Hiatt et al.
U.S. Appl. No. 11/217,877, Oliver et al.
U.S. Appl. No. 11/218,126, Farnworth et al.
U.S. Appl. No. 11/218,243, Kirby et al.
Aachboun, S. and P. Ranson, “Cryogenic etching of deep narrow trenches in silicon,” J. Vac. Sci. Technol. A 18(4), Jul./Aug. 2000, pp. 1848-1852.
Aachboun, S. and P. Ranson, “Deep anisotropic etching of silicon,” J. Vac. Sci. Technol. A 17(4), Jul./Aug. 1999, pp. 2270-2273.
Austin, M.D. and S.Y. Chou, “Fabrication of 70 nm channel length polymer organic thin-film transistors using nanoimprint lithography,” Applied Physics Letters, vol. 81, No. 23, pp. 4431-4433, Dec. 2, 2002, American Institute of Physics.
Blac

Affiliated with

Also associated with

Rating

Microelectronic imagers with optical devices having integral... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microelectronic imagers with optical devices having integral..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microelectronic imagers with optical devices having integral... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2736389