Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2005-12-13
2009-12-15
Chambliss, Alonzo (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S782000, C257S790000, C257SE23126, C257SE23129, C257SE21502, C438S126000
Reexamination Certificate
active
07633157
ABSTRACT:
Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. In one embodiment, a device includes a support member and a flexed microelectronic die mounted to the support member. The flexed microelectronic die has a plurality of terminals electrically coupled to the support member and an integrated circuit operably coupled to the terminals. The die can be a processor, memory, imager, or other suitable die. The support member can be a lead frame, a plurality of electrically conductive leads, and/or an interposer substrate.
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Jiang Tongbi
Sandireddy Sandhya
Xia Zhong-Yi
Chambliss Alonzo
Micro)n Technology, Inc.
Perkins Coie LLP
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