Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2007-10-31
2010-10-26
Smith, Matthew (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S253000, C438S396000, C438S393000, C438S399000, C257S707000, C257S706000, C257S534000, C257SE23105, C257SE23114
Reexamination Certificate
active
07820488
ABSTRACT:
A microelectronic device is made of a semiconductor substrate, a heat generating component in a layer thereof, and a body within the remaining semiconductor substrate. The body is made of materials which have a high thermal inertia and/or thermal conductivity. When high thermal conductivity materials are used, the body acts to transfer the heat away from the substrate to a heat sink.
REFERENCES:
patent: 6462410 (2002-10-01), Novotny et al.
patent: 6596581 (2003-07-01), Park et al.
patent: 2005/0254215 (2005-11-01), Khbeis et al.
Dang Hien
Hougham Gareth
Kang Sung
Mok Lawrence
Sharma Arun
Baptiste Wilner Jean
F. Chau & Associates LLC
International Business Machines - Corporation
Smith Matthew
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