Microelectronic device including bridging interconnect to...

Details Microelectronic device including bridging interconnect to... Microelectronic device including bridging interconnect to...

2006-12-13

2010-06-15

Landau, Matthew C (Department: 2813)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C257SE27113, C029S846000

Reexamination Certificate

active

07738257

ABSTRACT:
A microelectronic device, a method of fabricating the device, and a system including the device. The device includes: a substrate including a polymer build-up layer, and a passive structure embedded in the substrate. The passive structure includes a top conductive layer overlying the polymer build-up layer, a dielectric layer overlying the top conductive layer, and a bottom conductive layer overlying the dielectric layer. The device further includes a conductive via extending through the polymer build-up layer and electrically insulated from the bottom conductive layer, an insulation material insulating the conductive via from the bottom conductive layer, and a bridging interconnect disposed at a side of the top conductive layer facing away from the dielectric layer, the bridging interconnect electrically connecting the conductive via to the top conductive layer.

REFERENCES:
patent: 6224965 (2001-05-01), Haas et al.
patent: 7480150 (2009-01-01), Kariya et al.
patent: 2003/0136997 (2003-07-01), Shioga et al.
patent: 1020030040083 (2003-05-01), None
patent: 1020060112906 (2006-11-01), None
PCT/US2007/086665, Dec. 5, 2007, International Search Report.

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