Microelectronic device

Details Microelectronic device Microelectronic device

1982-01-18

1983-03-01

Demeo, Palmer C.

Electric lamp and discharge devices

With luminescent solid or liquid material

Solid-state type

357 72, H05B 3306, H01L 3300

Patent

active

043756069

ABSTRACT:
A method of bonding microelectronic components (10, 23, 24) is disclosed. A light emitting diode (10) is bonded to a conductive lead (24) and/or a portion of a lead frame (23) using an adhesive having no metallic particles therein. The diode (10) is clamped to the conductive lead (24) and/or the lead frame (23) as the epoxy is cured. Such bonds have been found to exhibit low contact resistance in addition to long life and reliability.

REFERENCES:
patent: 2244771 (1941-06-01), Figour
patent: 2774747 (1956-12-01), Wolfson et al.
patent: 3100080 (1963-08-01), Fiechter
patent: 3139364 (1964-06-01), Fiechter
patent: 3202596 (1965-08-01), Canevari
patent: 3536546 (1970-10-01), Nielsen
patent: 3795047 (1974-03-01), Abolafia et al.
patent: 3839783 (1974-10-01), Dankert
patent: 3863075 (1975-01-01), Ironmonger et al.
patent: 3889286 (1975-06-01), Debesis
patent: 3905094 (1975-09-01), Ruggiero
patent: 3923581 (1975-12-01), Payne et al.
"Epoxy Bonding Gives Good Electrical Conductivity", Design News, Sep. 19, 1977.
"Where Epoxy Die Bonding for Microelectronics Stands Today", by F. W. Kulesza in Insulation/Circuits, Nov. 1974, pp. 31 to 33.
"Epoxy Transfer and Print Head", by R. L. Moore, in Western Elect. Tech Digest, No. 50, Apr. 1978.

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