Microelectronic contacts with asperities and methods of making s

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

439 66, H01R 909

Patent

active

056326319

ABSTRACT:
Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.

REFERENCES:
patent: 3275736 (1966-09-01), Hotine et al.
patent: 3670409 (1972-06-01), Reimer
patent: 3797103 (1974-03-01), Desmond et al.
patent: 3818415 (1974-06-01), Evans et al.
patent: 4597617 (1986-07-01), Enochs
patent: 4655519 (1987-04-01), Evans et al.
patent: 4716049 (1987-12-01), Patraw
patent: 4783719 (1988-11-01), Jamison et al.
patent: 4818728 (1989-04-01), Rai et al.
patent: 4846704 (1989-07-01), Ikeya
patent: 4893172 (1990-01-01), Matsumoto et al.
patent: 4902606 (1990-02-01), Patraw
patent: 4924353 (1990-05-01), Patraw
patent: 4950173 (1990-08-01), Mimemura et al.
patent: 4975079 (1990-12-01), Beaman et al.
patent: 5006792 (1991-04-01), Malhi et al.
patent: 5006917 (1991-04-01), Kang et al.
patent: 5046953 (1991-09-01), Shreeve et al.
patent: 5053922 (1991-10-01), Matta et al.
patent: 5086337 (1992-02-01), Noro et al.
patent: 5123850 (1992-06-01), Elder et al.
patent: 5131852 (1992-07-01), Grabbe et al.
patent: 5133495 (1992-07-01), Angulas et al.
patent: 5152695 (1992-10-01), Grabbe et al.
patent: 5154341 (1992-10-01), Melton et al.
patent: 5173055 (1992-12-01), Grabbe
patent: 5181859 (1993-01-01), Foreman et al.
patent: 5196726 (1993-03-01), Nishiguchi et al.
patent: 5203075 (1993-04-01), Angulas et al.
patent: 5207585 (1993-05-01), Byrnes et al.
patent: 5228861 (1993-07-01), Grabbe
patent: 5261155 (1993-11-01), Angulas et al.
patent: 5261593 (1993-11-01), Casson et al.
patent: 5281684 (1994-01-01), Moore et al.
patent: 5346118 (1994-09-01), Degam et al.
patent: 5349500 (1994-09-01), Casson et al.
patent: 5354205 (1994-10-01), Feigenbaum et al.
"Construction Resistance of Microcone-Based Contacts", IEEE Transactions on Components, Packaging, and Manufacturing Technology --Part A, vol. 18, No. 2, Jun. 1995.
Design News, Jan. 17, 1994, "Tiny Filter Quashes EMI" Electronic Buyers' News, Issue 867, Aug. 16, 1993, Quieting Connectors Down by David Gabel.
TRW Data Technologies 1994 Brochure.
Multi-Chip Module Technologies and Alternatives: The Basics, Donn et al, EDS "Van Nostrand Rhinehold Company 1993, Chapter 10 (pp. 487-524), MCM To Printed Wiring Board (Second Level) Connection Technology Options" by Alan D. Knight Mechanical Interconnection System For Solder Bump Dice 1994 ITAP and Flip Chip Proceedings (pp. 82-86) Hill et al.
"A Tap Tape-Based Bare Chip Test and Burn-In Carrier", Nolan et al, 1994 ITAP and Flip Chip Proceedings (pp. 173-179).
"A Tab Tape-Based Bare Chip Test and Burn Carrier", 1994 ITAP and Flip Chip Poceedings, Nolan et al, pp. 173-179.
"Mechanical Interconnection System For Solder Bump Dice", 1994 ITAP and Flip Chip Proceedings, Hill et al, pp. 82-86.
"MCM to Printed Wiring Board (Second Level), Connection Technology Options", Alan D. Knight, pp. 504-509, pp. 521-523.
IEE Transaction on Components, Pacaging and Manufacturing Technology, Part A, vol. 18, No. 2, Jun. 1995, "Constriction Resistance of Microcone-Based Contacts".
"Supplementary Interconnection Devices", Ginsberg et al, Multichip Modules & Related Technologies, (pp. 201-229).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Microelectronic contacts with asperities and methods of making s does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microelectronic contacts with asperities and methods of making s, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microelectronic contacts with asperities and methods of making s will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2324476

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.