Microelectronic contacts with asperities and methods of making s

Details Microelectronic contacts with asperities and methods of making s Microelectronic contacts with asperities and methods of making s

1997-04-22

1999-08-10

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Distinct contact secured to panel circuit

H01R 909

Patent

active

059349140

ABSTRACT:
Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.

REFERENCES:
patent: 3275736 (1966-09-01), Hotine et al.
patent: 3509270 (1970-04-01), Dube et al.
patent: 3616532 (1971-11-01), Beck
patent: 3670409 (1972-06-01), Reimer
patent: 3797103 (1974-03-01), Desmond et al.
patent: 3818415 (1974-06-01), Evans et al.
patent: 3937386 (1976-02-01), Hartleroad et al.
patent: 3998377 (1976-12-01), Metz
patent: 4283839 (1981-08-01), Gursky
patent: 4295596 (1981-10-01), Doten et al.
patent: 4557043 (1985-12-01), Starsky
patent: 4597617 (1986-07-01), Enochs
patent: 4655519 (1987-04-01), Evans et al.
patent: 4696096 (1987-09-01), Green et al.
patent: 4783719 (1988-11-01), Jamison et al.
patent: 4818728 (1989-04-01), Rai et al.
patent: 4846704 (1989-07-01), Ikeya
patent: 4887760 (1989-12-01), Yoshino et al.
patent: 4893172 (1990-01-01), Matsumoto et al.
patent: 4913336 (1990-04-01), Yamazaki
patent: 4924353 (1990-05-01), Patraw
patent: 4937006 (1990-06-01), Bickford et al.
patent: 4937653 (1990-06-01), Blonder et al.
patent: 4950173 (1990-08-01), Minemura et al.
patent: 4950623 (1990-08-01), Dishon
patent: 4975079 (1990-12-01), Beaman et al.
patent: 5006792 (1991-04-01), Mahli et al.
patent: 5006917 (1991-04-01), Kang et al.
patent: 5046953 (1991-09-01), Shreeve et al.
patent: 5053922 (1991-10-01), Matta et al.
patent: 5057969 (1991-10-01), Ameen et al.
patent: 5086337 (1992-02-01), Noro et al.
patent: 5115964 (1992-05-01), Ameen et al.
patent: 5123850 (1992-06-01), Elder et al.
patent: 5131852 (1992-07-01), Grabbe et al.
patent: 5133495 (1992-07-01), Angulas et al.
patent: 5152695 (1992-10-01), Grabbe et al.
patent: 5154341 (1992-10-01), Melton et al.
patent: 5173055 (1992-12-01), Grabbe
patent: 5181859 (1993-01-01), Foreman et al.
patent: 5196726 (1993-03-01), Nishiguchi et al.
patent: 5199879 (1993-04-01), Kohn
patent: 5203075 (1993-04-01), Angulas et al.
patent: 5207585 (1993-05-01), Byrnes et al.
patent: 5228861 (1993-07-01), Grabbe
patent: 5261155 (1993-11-01), Angulas et al.
patent: 5261593 (1993-11-01), Casson et al.
patent: 5281684 (1994-01-01), Moore et al.
patent: 5282565 (1994-02-01), Melton
patent: 5328087 (1994-07-01), Nelson et al.
patent: 5346118 (1994-09-01), Degani et al.
patent: 5349495 (1994-09-01), Visel et al.
patent: 5349500 (1994-09-01), Casson et al.
patent: 5354205 (1994-10-01), Feigenbaum et al.
patent: 5430614 (1995-07-01), Difrancesco
patent: 5500605 (1996-03-01), Chang
Multi-Chip Module Technologies and Alternatives: The Basics, Donn et al. EDS Van Nostrand Rhinehold Company 1993, Chapter 10 (patent prosecution. 487-524).
TRW Data Technologies 1994 Brochure.
Design New, Jan. 17, 1994, "Tiny Filter Quashes EMI".
IEEE Transaction on Components, Packaging and Manufacturing Technology, Part A, vol. 18, No. 2, Jun. 1995, "Constriction Resistance of Microcone-Based Contacts".
"Supplementary Interconnection Devices", Ginsberg et al, Multichip Modules & Related Technologies, (pp. 201-229).
"Constriction Resistance of Microcone-Based Contacts", IEEE Transactions on Components, Packaging, and Manufacturing Technology--Part A, vol. 18, No. 2, Jun. 1995.
1994 ITAP & Flip Chip Proceedings, "A Tab Tape-Based bare Chip Test and Burn-In Carrier", Nolan et al. (pp. 173-179).
1994 ITAP & Flip Chip Proceedings, "Mechanical Interconnection System For Solder Bump Dice", Hill et al. (pp. 82-86).
Multichip Module Technologies and Alternatives: The Basics, Alan D. Knight, (pp. 504-509; 521-523).
Electronic Buyers' News, Issue 867, Aug. 16, 1993, "Quieting Connectors Down" by David Gabel.

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