Microelectronic contact structure

Electrical connectors – With insulation other than conductor sheath – Plural-contact coupling part

Reexamination Certificate

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Details

C361S761000

Reexamination Certificate

active

07731546

ABSTRACT:
A probing apparatus can include a plurality of contact probes, which can be of a type that is disposed along an axis. Each contact probe can include a contact portion, a base portion, and resilient portion. Multiple arms can form the resilient portion, which can be disposed between the contact portion and the base portion. The contact probes can be configured to twist when compressed. The probing apparatus can also include a substrate with through holes, and the contact probes can be inserted into the through holes. The resilient portion of each of the contact probes can bias the contact portion such that at least a portion of the contact portion extends out of a through hole.

REFERENCES:
patent: 3654585 (1972-04-01), Wickersham
patent: 4097101 (1978-06-01), Holt et al.
patent: 4418857 (1983-12-01), Ainslie et al.
patent: 4526429 (1985-07-01), Kirkman
patent: 4622514 (1986-11-01), Lewis
patent: 4773877 (1988-09-01), Kruger et al.
patent: 4965865 (1990-10-01), Trenary
patent: 5032787 (1991-07-01), Johnston et al.
patent: 5124646 (1992-06-01), Shiraishi
patent: 5148103 (1992-09-01), Pasiecznik, Jr.
patent: 5195237 (1993-03-01), Cray et al.
patent: 5225777 (1993-07-01), Bross et al.
patent: 5308443 (1994-05-01), Sugihara
patent: 5354712 (1994-10-01), Ho et al.
patent: 5366380 (1994-11-01), Reymond
patent: 5367254 (1994-11-01), Faure et al.
patent: 5399982 (1995-03-01), Driller et al.
patent: 5476818 (1995-12-01), Yanof et al.
patent: 5513430 (1996-05-01), Yanof et al.
patent: 5534787 (1996-07-01), Levy
patent: 5555422 (1996-09-01), Nakano
patent: 5573435 (1996-11-01), Grabbe et al.
patent: 5600257 (1997-02-01), Leas et al.
patent: 5629631 (1997-05-01), Perry et al.
patent: 5667410 (1997-09-01), Johnston
patent: 5686842 (1997-11-01), Lee
patent: 5806181 (1998-09-01), Khandros et al.
patent: 5821763 (1998-10-01), Beaman et al.
patent: 5828226 (1998-10-01), Higgins et al.
patent: 5829128 (1998-11-01), Eldridge et al.
patent: 5865641 (1999-02-01), Swart et al.
patent: 5917707 (1999-06-01), Khandros et al.
patent: 5921786 (1999-07-01), Slocum
patent: 5974662 (1999-11-01), Eldridge et al.
patent: 6014032 (2000-01-01), Maddix et al.
patent: 6031282 (2000-02-01), Jones et al.
patent: 6051982 (2000-04-01), Alcoe et al.
patent: 6059982 (2000-05-01), Palagonia et al.
patent: 6072190 (2000-06-01), Watanabe et al.
patent: 6083059 (2000-07-01), Kuan
patent: 6087840 (2000-07-01), Mizuta
patent: 6144212 (2000-11-01), Mizuta
patent: 6150830 (2000-11-01), Schmid et al.
patent: 6160412 (2000-12-01), Martel et al.
patent: 6184576 (2001-02-01), Jones et al.
patent: 6289583 (2001-09-01), Belmont et al.
patent: 6307392 (2001-10-01), Soejima et al.
patent: 6402567 (2002-06-01), Zhu
patent: 6447343 (2002-09-01), Zhang et al.
patent: 6559665 (2003-05-01), Barabi
patent: 6720787 (2004-04-01), Kimura et al.
patent: 6945827 (2005-09-01), Grube et al.
patent: 7179133 (2007-02-01), Forell et al.
patent: 661129 (1983-10-01), None
patent: 3129568 (1982-04-01), None
patent: 101 51 125 (2002-06-01), None
patent: 463684 (1996-04-01), None
patent: 1 365 250 (2003-11-01), None
patent: 61-19770 (1986-02-01), None
patent: 62-197073 (1987-12-01), None
patent: 05-218156 (1993-08-01), None
patent: 06-50990 (1994-02-01), None
patent: 07-021968 (1995-01-01), None
patent: 07-333232 (1995-12-01), None
patent: 08-083661 (1996-03-01), None
patent: 08-508613 (1996-09-01), None
patent: 2000-292436 (2000-10-01), None
patent: 2001-052827 (2001-02-01), None
patent: 2001-056345 (2001-02-01), None
patent: 2001-519904 (2001-10-01), None
patent: 2003-194847 (2003-07-01), None
patent: 334607 (1998-06-01), None
patent: WO 94/23475 (1994-10-01), None
patent: WO 98/44354 (1998-10-01), None

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