Microelectronic contact structure

Electrical connectors – With insulation other than conductor sheath – Plural-contact coupling part

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S761000

Reexamination Certificate

active

06945827

ABSTRACT:
An elongate, columnar micro-mechanical structure disposed along a central longitudinal axis; the structure is made up of laminated structural layers, each comprised of a structural material. The layers define a substantially rigid base portion at a proximal end of the structure, a resilient intermediate portion extending from the base portion along the central axis, and a contact tip extending from the resilient portion at a distal end of the structure. The resilient portion of the contact structure is comprised of resilient arms defined in the layers. Opposite ends of the resilient arms may be angularly offset with respect to one another around the central axis. Accordingly, when the contact structure is compressed in an axial direction, the contact tip will rotate around the central axis, while the base remains fixed, providing beneficial wiping action to the contact tip.

REFERENCES:
patent: 3654585 (1972-04-01), Wickersham
patent: 4418857 (1983-12-01), Ainslie et al.
patent: 4622514 (1986-11-01), Lewis
patent: 4965865 (1990-10-01), Trenary
patent: 5032787 (1991-07-01), Johnston et al.
patent: 5124646 (1992-06-01), Shiraishi
patent: 5148103 (1992-09-01), Pasiecznik, Jr.
patent: 5195237 (1993-03-01), Cray et al.
patent: 5225777 (1993-07-01), Bross et al.
patent: 5308443 (1994-05-01), Sugihara
patent: 5354712 (1994-10-01), Ho et al.
patent: 5366380 (1994-11-01), Reymond
patent: 5367254 (1994-11-01), Faure et al.
patent: 5399982 (1995-03-01), Driller et al.
patent: 5476818 (1995-12-01), Yanof et al.
patent: 5513430 (1996-05-01), Yanof et al.
patent: 5534787 (1996-07-01), Levy
patent: 5555422 (1996-09-01), Nakano
patent: 5573435 (1996-11-01), Grabbe et al.
patent: 5600257 (1997-02-01), Leas et al.
patent: 5629631 (1997-05-01), Perry et al.
patent: 5686842 (1997-11-01), Lee
patent: 5806181 (1998-09-01), Khandros et al.
patent: 5821763 (1998-10-01), Beaman et al.
patent: 5828226 (1998-10-01), Higgins et al.
patent: 5829128 (1998-11-01), Eldridge et al.
patent: 5917707 (1999-06-01), Khandros et al.
patent: 5974662 (1999-11-01), Eldridge et al.
patent: 6014032 (2000-01-01), Maddix et al.
patent: 6031282 (2000-02-01), Jones et al.
patent: 6051982 (2000-04-01), Alcoe et al.
patent: 6059982 (2000-05-01), Palagonia et al.
patent: 6072190 (2000-06-01), Watanabe et al.
patent: 6083059 (2000-07-01), Kuan
patent: 6087840 (2000-07-01), Mizuta
patent: 6144212 (2000-11-01), Mizuta
patent: 6150830 (2000-11-01), Schmid et al.
patent: 6160412 (2000-12-01), Martel et al.
patent: 6184576 (2001-02-01), Jones et al.
patent: 6289583 (2001-09-01), Belmont et al.
patent: 6307392 (2001-10-01), Soejima et al.
patent: 661129 (1983-10-01), None
patent: 3129568 (1982-04-01), None
patent: 101 51 125 (2002-06-01), None
patent: 463684 (1996-04-01), None
patent: 1 365 250 (2003-11-01), None
patent: 61-19770 (1986-02-01), None
patent: 62-197073 (1987-12-01), None
patent: 05-218156 (1993-08-01), None
patent: 06-50990 (1994-02-01), None
patent: 07-021968 (1995-01-01), None
patent: 07-333232 (1995-12-01), None
patent: 2001-052827 (2001-02-01), None
patent: 334607 (1998-06-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Microelectronic contact structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microelectronic contact structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microelectronic contact structure will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3379731

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.