Electrical connectors – With insulation other than conductor sheath – Plural-contact coupling part
Reexamination Certificate
2000-11-02
2002-06-25
Bradley, P. Austin (Department: 2833)
Electrical connectors
With insulation other than conductor sheath
Plural-contact coupling part
C439S620040
Reexamination Certificate
active
06409548
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates generally to miniature electrical connectors used in printed circuit board and other microelectronic applications, and more particularly to a microelectronic connector with improved modularity and a method of fabricating the same.
2. Description of Related Technology
Existing microelectronic electrical connectors (such as those of the RJ 45 or RJ 11 type) frequently incorporate magnetics or other electrical components to provide a variety of functions, such as signal voltage transformation or noise suppression. In one common connector design, the magnetics or component package is fabricated as a separate device that is then subsequently inserted within or mated to another component of the connector. See, for example, U.S. Pat. No. 5,647,767 “Electrical Connector Jack Assembly for Signal Transmission” (“'767 patent”), and U.S. Pat. No. 5,587,884, “Electrical Connector Jack with Encapsulated Signal Conditioning Components” (“'884 patent”). A related design illustrated in U.S. Pat. No. 5,178,563, “Contact Assembly and Method for Making Same” employs the multi-component arrangement of the '767 and '884 patents, yet with no installed electrical component. Common to each of the aforementioned designs is the use of a separate lead insulator or “carrier” that insulates and segregates the electrical leads connecting the modular plug contacts with the electrical component (or output leads of the connector). This general lead carrier arrangement is illustrated in
FIG. 1
a.
In addition to the functions listed above, as shown in
FIG. 1
b,
a lead carrier
110
also acts as a mechanical fulcrum for the leads
120
when installed. Specifically, the distal ends
115
of the leads engage contacts of a modular plug
130
when the plug
130
is inserted into a connector body
100
, thereby tending to bend the leads
120
upward and away from the plug
130
. The modular plug
130
has a latch
131
which securely engages the plug
130
with the connector body
100
. The plug
130
is shown in
FIG. 1
b
with the latch
131
on the underside of the plug, also referred to as a “latch-down” configuration. The carrier
110
tends to maintain the leads
120
in engagement with their respective contacts on the modular plug
130
, thereby increasing the reliability of the connector. This is especially true during relative movement of the plug
130
within the connector body
100
or after many insertion/removal duty cycles.
While providing the above-identified functionality, the use of a lead carrier
110
has several drawbacks as well. Specifically, the additional labor and materials associated with molding and inspecting the lead carrier
110
add significant cost to the final product. Furthermore, the connector body (“sleeve”)
100
requires additional costly tooling to accommodate the carrier
110
. After carrier insertion, the distal ends of the leads
120
must also be bent into their final position. This adds another process step and precludes the subsequent removal of the leads
120
and carrier
110
from the connector body
100
. Additionally, the carrier
110
provides no bias or resistance to separating the component package
140
(and carrier
110
) from the connector body
100
, thereby necessitating the use of adhesives or other means for maintaining a solid connection of these components.
Once an existing microelectronic connector has been installed in, for example, a printed circuit board, replacement of the component package
140
requires removal and replacement of the entire connector. Further, one set of leads
150
is typically soldered to the circuit board to provide mechanical stability and a secure electrical connection. Thus, removal of the connector and the attached component package
140
is made difficult.
Accordingly, it would be most desirable to provide an improved microelectronic connector design that would yield a simpler and more reliable connector, and further facilitate more economical fabrication. Such a connector design would avoid the use of a separate lead carrier and mating adhesives, thereby simplifying the manufacturing process and reducing device cost. The improved connector would also utilize a simplified and compact mounting system to further reduce manufacturing costs. Additionally, the improved connector would provide for simple replacement of components.
SUMMARY OF THE INVENTION
The invention satisfies the aforementioned needs by providing an improved microelectronic connector and method of fabricating the same.
According to one aspect of the invention, a microelectronic connector assembly comprises an insert having a first cavity which is configured to receive at least one electrical component; a set of leads extending from the insert, the set of leads being configured to provide an electrical connection between the electrical component and a modular plug; and a connector body having a front, a back, and a dividing wall separating the front from the back, the front having a second cavity adapted to receive a modular plug therein, the back having a third cavity for receiving the insert, and the dividing wall having a set of openings providing communication between the second cavity and the third cavity, wherein the set of leads are configured to protrude through the set of openings into the second cavity.
According to another aspect of the invention, a method of manufacturing a microelectronic connector comprises providing a connector body with a front having a first cavity adapted to receive modular plugs, a back having a second cavity adapted to receive an insert, and a dividing wall separating the front from the back, the dividing wall having openings for allowing leads to pass between the first cavity and the second cavity; and inserting an insert into the second cavity, the insert having a set of leads and a third cavity, the set of leads passing through the openings into the second cavity, the third cavity being adapted to receive at least one electrical component.
According to yet another aspect of the invention, a microelectronic connector assembly comprises an insert, the insert comprising means for receiving at least one electrical component and means for electrically connecting the electrical component with a modular plug; and a connector body, the connector body comprising means for receiving a modular plug in a first location; means for receiving the insert in a second location different from the first location; and means for separating the means for receiving a modular plug and the means for receiving the insert, the separating means including means for passing the electrically connecting means between the means for receiving a modular plug and the means for receiving the insert.
According to another aspect of the invention, a microelectronic connector assembly comprises an insert having a first cavity configured to receive at least one electrical component; and a connector body having a front, a back, and a dividing wall separating the front from the back, the front having a second cavity adapted to receive a modular plug therein, the back having a third cavity for receiving the insert, and the dividing wall having a set of openings providing communication between the second cavity and the third cavity.
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Bradley P. Austin
Gilman Alexander
Knobbe Martens Olson & Bear LLP
Pulse Engineering Inc.
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