Microelectronic components and thick-film hybrid circuits

Details Microelectronic components and thick-film hybrid circuits Microelectronic components and thick-film hybrid circuits

1987-07-24

1989-01-31

Jacobs, Lewis T.

Electricity: electrical systems and devices

Miscellaneous

428480, 428901, 524604, 524605, H05K 118, B32B 2736

Patent

active

048020613

ABSTRACT:
In microelectronic components and thick-film hybrid circuits, the multilayer substrates of the said components and the substrates of the said circuits are produced using liquid crystalline polymers which can be processed by a thermoplastic method.

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Inzenhofer, "Dickschicht-Hybridschaltungen, neue Fertigungstechnik fur die Industrieelektronik", Technik Heute, 1985, pp. 24-32.
Mehrschichtenkeramik-Technologie fur das "Thermal Conduction Module", Berichte der deutschen keramischen Gesellschaft, Part 7, 1981, pp. 553-557.
A. G. Saunders, "Plastics in Integrated Circuit Packaging", Shell Polymers, vol. 9, Part 1, 1985, pp. 12-15.

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