Microelectronic component mounting with deformable shell termina

Details Microelectronic component mounting with deformable shell termina Microelectronic component mounting with deformable shell termina

1996-12-27

1999-10-26

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

228104, 228189, B23K 3102, B23K 3112

Patent

active

059712538

ABSTRACT:
A microelectronic element assembly such as a semiconductor chip assembly uses a connection component incorporating a dielectric sheet with electrically conductive elements therein. Each electrically conductive element may include a flexible shell. The flexible shells can be formed to assure reliable engagement with mating contact pads.

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