Microelectronic component fabrication facility, and process for

Details Microelectronic component fabrication facility, and process for Microelectronic component fabrication facility, and process for

1996-05-31

1998-08-18

Graybill, David

Metal working

Barrier layer or semiconductor device making

438800, 438908, H01L 2150, B01L 104

Patent

active

057953562

ABSTRACT:
A process for manufacturing microelectronic components that can be fabricated in a facility 1 including integrated circuits on silicon wafers, flat panel displays on glass substrates or any other microelectronic components fabricated in a similar fashion, a process of constructing the facility, and the facility. The fabrication facility 1 relies on a central hub 3 from which processing areas 2 extend out radially like spokes. The processing areas 2 are arranged in a pattern so as to be served by common services which include gases, chemicals, ultra pure water, vapor exhaust, liquid waste, air conditioning, centralized vacuum, centralized clean compressed air, hot water, steam, natural gas, power including emergency, conditioned, and unconditioned power, and process cooling water.

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