Microelectronic component assemblies with recessed wire...

Details Microelectronic component assemblies with recessed wire... Microelectronic component assemblies with recessed wire...

2007-07-31

2007-07-31

Tran, Long K. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S015000, C438S025000, C438S112000, C438S127000, C257S787000, C257S788000, C257SE23128

Reexamination Certificate

active

10929640

ABSTRACT:
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, a substrate, and at least one bond wire. The substrate has a reduced-thickness base adjacent terminals of the microelectronic component and a body having a contact surface spaced farther from the microelectronic component than a bond pad surface of the base. The bond wire couples the microelectronic component to a bond pad carried by the bond pad surface and has a maximum height outwardly from the microelectronic component that is no greater than the height of the contact surface from the microelectronic component.

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