Microelectronic component assemblies having lead frames...

Details Microelectronic component assemblies having lead frames... Microelectronic component assemblies having lead frames...

2007-02-07

2009-10-13

Smith, Zandra (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S123000, C174S536000

Reexamination Certificate

active

07601562

ABSTRACT:
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, the invention provides a microelectronic component assembly that includes spaced-apart first and second lead frame members. A packaged element is disposed between the lead frame members and attached thereto only by a plurality of elongate, flexible links that permit the packaged element to accommodate thermally induced stresses by floating with respect to the first and second lead frame members.

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Kingston Technology Company, Inc., “The Ultimate Memory Guide. Everything You Ever Wanted to Know About Memory,” pp. 21-27, retrieved from the Internet on Mar. 1, 2003, <http://www.kingston.com/tools/umg/umg.pdf>.
United Test and Assembly Center Ltd., “Multi Chip Package,” 1 page, retrieved from the Internet on Oct. 20, 2002, <http://www.utac.com.sg/html/products/multichip—pkg.html>.
United Test and Assembly Center Ltd., “TSOP II. Thin Small Outline Package Type II Datasheet,” 2 pages, retrieved from the Internet on Oct. 20, 2002, <http://www.utac.com.sg/html/products/PDF%20datasheet/TSOP%202%20Datasheet.pdf>.

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