Microelectronic component and assembly having leads with...

Details Microelectronic component and assembly having leads with... Microelectronic component and assembly having leads with...

2006-08-29

2006-08-29

Graybill, David E. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S125000

Reexamination Certificate

active

07098078

ABSTRACT:
A microelectronic component comprising a dielectric layer having an opening and leads extending across the opening is disclosed. The leads have an offset portion. A method of making a microelectronic assembly comprises connecting each of the leads to a contact on a microelectronic element. A semiconductor chip assembly has a microelectronic component with an opening and leads extending across the opening. The leads are connected to contacts on a semiconductor chip and have at least one twisted portion.

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