Microelectronic cleaning compositions containing...

Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...

Reexamination Certificate

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C134S002000, C134S026000, C134S028000, C134S029000, C134S030000, C134S034000, C134S035000, C134S036000, C134S041000, C134S042000, C134S902000

Reexamination Certificate

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10483036

ABSTRACT:
Ammonia-free, HF-free cleaning compositions for cleaning photoresist and plasma ash residues from microelectronic substrates, and particularly to such cleaning compositions useful with and having improved compatibility with microelectronic substrates characterized by sensitive porous and low-k to high-k dielectrics and copper metallization. The cleaning composition contain one or more non-ammonium producing, non-HF producing fluoride salt (non ammonium, quaternary ammonium fluoride salt) in a suitable solvent matrix.

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