Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...
Reexamination Certificate
2007-07-24
2007-07-24
Carrillo, Sharidan (Department: 1746)
Cleaning and liquid contact with solids
Processes
For metallic, siliceous, or calcareous basework, including...
C134S002000, C134S026000, C134S028000, C134S029000, C134S030000, C134S034000, C134S035000, C134S036000, C134S041000, C134S042000, C134S902000
Reexamination Certificate
active
10483036
ABSTRACT:
Ammonia-free, HF-free cleaning compositions for cleaning photoresist and plasma ash residues from microelectronic substrates, and particularly to such cleaning compositions useful with and having improved compatibility with microelectronic substrates characterized by sensitive porous and low-k to high-k dielectrics and copper metallization. The cleaning composition contain one or more non-ammonium producing, non-HF producing fluoride salt (non ammonium, quaternary ammonium fluoride salt) in a suitable solvent matrix.
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Patent Abstracts of Japan, vol. 2000, No. 16, May 8, 2001 of JP 2001 005201, Jan. 12, 2001.
Carrillo Sharidan
Mallinckrodt Baker Inc.
Rauchfuss, Jr. George W.
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