Microelectronic circuit coating system

Coating apparatus – With cutting – punching or tearing of work – Web or sheet work

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Details

118 491, 118504, 427 99, C23C 1302

Patent

active

040418960

ABSTRACT:
A coating system applies silicon dioxide to microelectronic dies mounted on electrical conductor systems such as lead frames, circuit boards and to connecting wires in a single operation while preventing the deposition of silicon dioxide on the outer portions of leads which are formed as part of its lead frame.

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