Microelectronic bonding with lead motion

Details Microelectronic bonding with lead motion Microelectronic bonding with lead motion

1995-11-01

1997-04-08

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174261, 361772, 361774, 29832, 29835, 439 84, 439 74, 439 65, H05K 114

Patent

active

056190174

ABSTRACT:
A method of connecting a semiconductor chip assembly having at least first and second contacts to a connection component including at least first and second connection leads by means of a tool consisting of the steps of juxtaposing moving and connecting the leads to the corresponding contacts. The connection component is juxtaposed with the semiconductor chip assembly so that the first and second connection leads are aligned with the first and second contacts in such a manner that the first connection lead is offset from the first contact in the first direction and the second connection lead is offset from the second contact in the same first direction. The first connection lead is moved by means of the tool substantially downwardly and towards the first contact in a second direction which is opposite to the first direction, so that an open space is formed between the first connection lead and the second contact and lead to facilitate movement of the second connection lead by the tool substantially downwardly and towards the second contact in the second direction.

REFERENCES:
patent: 5127570 (1992-07-01), Steitz et al.
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5148266 (1992-09-01), Khandros et al.
patent: 5173574 (1992-12-01), Kraus
patent: 5489749 (1996-02-01), DiStefano et al.
patent: 5491302 (1996-02-01), Distefano et al.

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