Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate
2011-04-12
2011-04-12
Andújar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
C257S698000
Reexamination Certificate
active
07923851
ABSTRACT:
A microelectronic assembly can include a microelectronic device having device contacts exposed at a surface thereof and an interconnection element having element contacts and having a face adjacent to the microelectronic device. Conductive elements, e.g., wirebonds connect the device contacts with the element contacts and have portions extending in runs above the surface of the microelectronic device. A conductive layer has a conductive surface disposed at at least a substantially uniform distance above or below the plurality of the runs of the conductive elements. In some cases, the conductive material can have first and second dimensions in first and second horizontal directions which are smaller than first and second corresponding dimensions of the microelectronic device. The conductive material is connectable to a source of reference potential so as to achieve a desired impedance for the conductive elements.
REFERENCES:
patent: 4680613 (1987-07-01), Daniels et al.
patent: 5468999 (1995-11-01), Lin et al.
patent: 5523621 (1996-06-01), Kikuchi
patent: 5639989 (1997-06-01), Higgins, III
patent: 6001671 (1999-12-01), Fjelstad
patent: 6476506 (2002-11-01), O'Connor et al.
patent: 6538336 (2003-03-01), Secker et al.
patent: 6667546 (2003-12-01), Huang et al.
patent: 6770822 (2004-08-01), Pasternak et al.
patent: 6812580 (2004-11-01), Wenzel et al.
patent: 7217997 (2007-05-01), Wyland
patent: 7303113 (2007-12-01), Kwark et al.
patent: 7456505 (2008-11-01), Gospodinova et al.
patent: 7466021 (2008-12-01), Fjelstad
patent: 7468560 (2008-12-01), Guengerich et al.
patent: 7528011 (2009-05-01), Yano et al.
patent: 7537962 (2009-05-01), Jang et al.
patent: 2001/0015490 (2001-08-01), Lee
patent: 2003/0090001 (2003-05-01), Beatson et al.
patent: 2004/0164389 (2004-08-01), Lee
patent: 2005/0098870 (2005-05-01), Thomas et al.
patent: 2006/0125079 (2006-06-01), Wyland et al.
patent: 2006/0131742 (2006-06-01), Tzu
patent: 2006/0180916 (2006-08-01), Wyland
patent: 2007/0105272 (2007-05-01), Lee et al.
patent: 2008/0088012 (2008-04-01), Ohkawa
patent: 0915504 (1999-05-01), None
patent: 7058138 (1995-03-01), None
patent: 2000332160 (2000-11-01), None
patent: 2001007140 (2001-01-01), None
patent: 2004112143 (2004-04-01), None
patent: 100270817 (2000-11-01), None
patent: 20050002659 (2005-01-01), None
patent: 100702970 (2007-01-01), None
patent: 2008/008948 (2008-01-01), None
Partial International Search Report and Invitation to Pay Additional Fees, PCT/US2010/027141, dated Jan. 27, 2011.
Haba Belgacem
Marcucci Brian
Andújar Leonardo
Lerner David Littenberg Krumholz & Mentlik LLP
Tessera Research LLC
LandOfFree
Microelectronic assembly with impedance controlled wirebond... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Microelectronic assembly with impedance controlled wirebond..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microelectronic assembly with impedance controlled wirebond... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2686684