Microelectronic assembly having thermoelectric elements to...

Details Microelectronic assembly having thermoelectric elements to... Microelectronic assembly having thermoelectric elements to...

2006-04-25

2006-04-25

Potter, Roy Karl (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S720000

Reexamination Certificate

active

07034394

ABSTRACT:
A microelectronic assembly is provided, having thermoelectric elements formed on a die so as to pump heat away from the die when current flows through the thermoelectric elements. In one embodiment, the thermoelectric elements are integrated between conductive interconnection elements on an active side of the die. In another embodiment, the thermoelectric elements are on a backside of the die and electrically connected to a carrier substrate on a front side of the die. In a further embodiment, the thermoelectric elements are formed on a secondary substrate and transferred to the die.

REFERENCES:
patent: 6230497 (2001-05-01), Morris et al.
patent: 6614109 (2003-09-01), Cordes et al.
patent: 2002/0024154 (2002-02-01), Hara et al.
patent: 2002/0113289 (2002-08-01), Cordes et al.
patent: 2003/0122245 (2003-07-01), Chu et al.

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