Microelectronic assembly formation with releasable leads

Details Microelectronic assembly formation with releasable leads Microelectronic assembly formation with releasable leads

2005-09-06

2005-09-06

Lebentritt, Michael S. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S118000, C438S127000, C438S617000, C438S739000, C257S692000, C257S674000, C257S784000, C257SE23068, C257SE23069

Reexamination Certificate

active

06939735

ABSTRACT:
A first microelectronic element is provided with leads having anchor ends connected to contacts and tip ends moveable with respect to the first microelectronic element. The leads can be provided on a carrier sheet that is assembled to the first microelectronic element, or may be formed in situ on the surface of the first element. The leads may be unitary strips of a conductive material, and the anchor ends of the leads may be bonded to the contacts of the first microelectronic element by processes such as thermosonic or ultrasonic bonding. Alternatively, stub leads may be provided on a separate carrier sheet or formed in situ on the front surface of the first microelectronic element, and these stub leads may be connected by wire bonds to the contacts of the first microelectronic element so as to form composite leads. The tip ends of the leads are joined to a second microelectronic element that is moved away from the first microelectronic element so as to deform the leads.

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Provisional U.S. Appl. No. 60/204,735, filed May 16, 2000.
U.S. Appl. No. 09/858,770, filed May 16, 2001.

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