Microelectroforming mold using a preformed metal as the...

Plastic and nonmetallic article shaping or treating: processes – With step of making mold or mold shaping – per se

Reexamination Certificate

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C264S328100, C249S135000, C205S070000, C205S114000, C228S194000

Reexamination Certificate

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06881369

ABSTRACT:
The invention discloses a microelectroforming mold using a preformed metal as the substrate and its fabrication method. Using a preformed metal as the substrate can avoid deformation of the microelectroforming mold due to residual stress in the electroforming metal. The fabrication method disclosed herein includes the steps of: forming a layer of bonding material on a surface of the preformed metal substrate after machining; forming a high aspect ratio photoresist microstructure on surfaces of the metal substrate and the bonding material; putting an electroforming material into the gaps of the photoresist microstructure to form an electroforming metal microstructure; and using a thermal process to bond the metal substrate and the metal micro structure by the bonding material and simultaneously bum off the photoresist microstructure to form a micro-electroforming mold. The invention shortens the electroforming time to be one third of the prior art, elongating the number of times the micro-electroforming mold can be used by a factor of more than three.

REFERENCES:
patent: 6644537 (2003-11-01), Chiu et al.
patent: 6699643 (2004-03-01), Asukata
patent: 20020093119 (2002-07-01), Morale
patent: 20020115016 (2002-08-01), Warren
patent: 2003245925 (2003-09-01), None
The American Heritage Dictionary for the English Language, 4th Ed., definition for “aspect ratio” (as provided at http://education.yahoo.com/reference/dictionary/entry/aspect+ ratio).

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