Microduct cable system having reduced thermal expansion force

Optical waveguides – Optical transmission cable

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C385S112000

Reexamination Certificate

active

11476616

ABSTRACT:
A cable system and method including a cable or a microduct provided within the groove extending vertically into, but not through, a pavement. The cable has a central strength member, at least one buffer tube stranded around the central strength member, an outerjacket surrounding the buffer tube and central strength member, and at least one transmission element provided within said at least one buffer tube. Provided within the microduct is a microduct cable including at least one transmission element. A cable including a central strength member, at least one buffer tube stranded around the central strength member, an outer jacket surrounding the buffer tube and central strength member, and at least one transmission element provided within said at least one buffer tube. The cable has a longitudinal thermal expansion force due to a change in temperature from 20° C. to 70° C. of less than 305 lbs when constrained.

REFERENCES:
patent: 3713947 (1973-01-01), Hawkins
patent: 4554724 (1985-11-01), Bantz
patent: 4939512 (1990-07-01), Dennison et al.
patent: 5911023 (1999-06-01), Risch et al.
patent: 6371691 (2002-04-01), Finzel et al.
patent: 6484711 (2002-11-01), Acker et al.
patent: 6807355 (2004-10-01), Dofher
patent: 7050683 (2006-05-01), Dofher
patent: 2003/0059182 (2003-03-01), Johnson et al.
patent: 2003/0123824 (2003-07-01), Tatarka et al.
patent: 2003/0123935 (2003-07-01), Dofher
patent: 0 861 455 (1996-11-01), None
patent: 410148586 (1998-06-01), None
patent: 410153495 (1998-06-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Microduct cable system having reduced thermal expansion force does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microduct cable system having reduced thermal expansion force, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microduct cable system having reduced thermal expansion force will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3726702

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.