Microdisplay packaging system

Details Microdisplay packaging system Microdisplay packaging system

2008-06-03

2011-10-25

Mitchell, James (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Regenerative type switching device

With housing or external electrode

C257S059000, C257S440000

Reexamination Certificate

active

08044431

ABSTRACT:
Some embodiments provide a microdisplay integrated circuit (IC), a substantially transparent protective cover coupled to the microdisplay IC, and a base coupled to the microdisplay IC. Thermal expansion characteristics of the base may be substantially similar to thermal expansion characteristics of the protective cover. According to some embodiments, at least one set of imaging elements is fabricated on an upper surface of a semiconductor substrate, and a base is affixed to a lower surface of the semiconductor substrate to generate substantially negligible mechanical stress between the semiconductor substrate and the base.

REFERENCES:
patent: 4827118 (1989-05-01), Shibata et al.
patent: 4905021 (1990-02-01), Iizuka et al.
patent: 5118361 (1992-06-01), Fraas et al.
patent: 5223741 (1993-06-01), Bechtel et al.
patent: 5508740 (1996-04-01), Miyaguchi et al.
patent: 5600148 (1997-02-01), Cole et al.
patent: 5919329 (1999-07-01), Banks et al.
patent: 5973391 (1999-10-01), Bischoff et al.
patent: 5997152 (1999-12-01), Taninaka et al.
patent: 6081305 (2000-06-01), Sato et al.
patent: 6187605 (2001-02-01), Takasu et al.
patent: 6198166 (2001-03-01), Coronati
patent: 6228675 (2001-05-01), Ruby et al.
patent: 6388888 (2002-05-01), Seko et al.
patent: 6494371 (2002-12-01), Rekow et al.
patent: 6556261 (2003-04-01), Krusius et al.
patent: 6556269 (2003-04-01), Takiar et al.
patent: 6590346 (2003-07-01), Hadley et al.
patent: 6610997 (2003-08-01), Murade
patent: 6614103 (2003-09-01), Durocher et al.
patent: 6639714 (2003-10-01), Smith et al.
patent: 6720206 (2004-04-01), Choi
patent: 6773958 (2004-08-01), Wang
patent: 6816385 (2004-11-01), Alcoe
patent: 6825059 (2004-11-01), Fossum
patent: 6849916 (2005-02-01), Glenn et al.
patent: 6864944 (2005-03-01), Scattergood et al.
patent: 6891194 (2005-05-01), Izumi
patent: 6894853 (2005-05-01), Haskett et al.
patent: 6933604 (2005-08-01), Sakamoto et al.
patent: 6975512 (2005-12-01), Ooi
patent: 7034785 (2006-04-01), Koma
patent: 7329861 (2008-02-01), Ma et al.
patent: 7361940 (2008-04-01), Kim et al.
patent: 2001/0030725 (2001-10-01), Shinohara et al.
patent: 2002/0000630 (2002-01-01), Coyle
patent: 2002/0004251 (2002-01-01), Roberts et al.
patent: 2002/0101557 (2002-08-01), Ono et al.
patent: 2002/0149312 (2002-10-01), Roberts et al.
patent: 2002/0163006 (2002-11-01), Yoganandan et al.
patent: 2003/0034566 (2003-02-01), Jimarez et al.
patent: 2003/0095116 (2003-05-01), Koyama
patent: 2003/0136962 (2003-07-01), Miyajima et al.
patent: 2003/0160256 (2003-08-01), Durocher et al.
patent: 2003/0213956 (2003-11-01), Hioki et al.
patent: 2004/0016995 (2004-01-01), Kuo et al.
patent: 2004/0041222 (2004-03-01), Loh
patent: 2004/0080034 (2004-04-01), Satomi et al.
patent: 2004/0084778 (2004-05-01), Hosoda et al.
patent: 2004/0097005 (2004-05-01), Daniels
patent: 2004/0136146 (2004-07-01), Saitoh et al.
patent: 2004/0197967 (2004-10-01), Chen
patent: 2004/0222516 (2004-11-01), Lin et al.
patent: 2004/0234213 (2004-11-01), Narayan et al.
patent: 2005/0045974 (2005-03-01), Hellekson et al.
patent: 2005/0052606 (2005-03-01), Lee et al.
patent: 2005/0062167 (2005-03-01), Huang et al.
patent: 2005/0077616 (2005-04-01), Ng et al.
patent: 2005/0087754 (2005-04-01), Erchak
patent: 2005/0093134 (2005-05-01), Tarn
patent: 2005/0121768 (2005-06-01), Edelstein et al.
patent: 2006/0055864 (2006-03-01), Matsumura et al.
patent: 2006/0205102 (2006-09-01), French et al.
patent: 2009/0032925 (2009-02-01), England

Affiliated with

Also associated with

Rating

Microdisplay packaging system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microdisplay packaging system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microdisplay packaging system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4267551